| Processor |
| CPU |
- 4th Gen Intel® Xeon® Scalable processors
- Dual Socket LGA-4677 (Socket E) supported, CPU TDP supports Up to 350W TDP
- SP XCC, SP MCC, and MAX Series (HBM) SKUs are supported
|
| Core |
Up to 60 cores |
| System Memory |
| Memory Capacity |
- 32 DIMM slots
- Up to 8TB 3DS ECC RDIMM, DDR5-4800MHz
|
| Memory Type |
4800/4400/4000 MT/s ECC DDR5 RDIMM (3DS) Up to 256GB of memory with speeds of up to 4400MT/s (2DPC) |
| DIMM Sizes |
- 16GB, 32GB, 64GB, 128GB, 256GB
- RDIMM: 16GB, 32GB, 64GB, 128GB, 256GB
|
| Memory Voltage |
1.1V |
| Error Detection |
- Corrects single-bit errors
- Detects double-bit errors (using ECC memory)
|
| GPU |
| Max GPU Count |
Supports up to 10 Double Width, 10 Single Width GPUs |
| CPU-GPU Interconnect |
PCIe 5.0 x16 Switch Dual-Root |
| GPU-GPU Interconnect |
NVIDIA® NVLink™ Bridge (optional) |
| Expansion Slots |
| PCIe |
12 PCIe 5.0 x8 PCIe5.0 MCIO connector |
| M.2 |
- M.2 Interface: 2 PCIe 4.0 x4
- Form Factor: 22110, 2280
- Key: M-Key
|
| On-Board Devices |
| Chipset |
Intel® C741 |
| IPMI |
- Support for Intelligent Platform Management Interface v.2.0
- IPMI 2.0 with virtual media over LAN and KVM-over-LAN support
|
| Network Connectivity |
2 x 10GbE BaseT with Intel® X710-AT2 |
